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neC'sL,s-BanDHigHpower UPG2009TB spDtswitCH
Features
* * * * LowinsertionLoss: 0.25dBTYP.@Vcont1/2=2.8V/0V,f=1.0GHz 0.30dBTYP.@Vcont1/2=2.8V/0V,f=2.0GHz HigHisoLation: 28dBTYP.@Vcont1/2=2.8V/0V,f=2.0GHz powerHanDLing: Pin(0.1dB)=34dBmTYP.@Vcont1/2=2.8V/0V,f=1.0GHz BiDireCtionaL,sYMMetriCaL
DesCription
NEC'sUPG2009TBisaL,S-bandSPDT(Single PoleDoubleThrow)GaAsFETswitchfordigitalcellularorcordlesstelephoneapplication.Thedevicecan operatefrom500MHzto2.5GHz,withlowinsertion lossandhighisolation.
* 6-pinsuperMiniMoLDpaCkage(2.0x1.25x0.9mm)
appLiCations
* L-banddigitalcellularorcordlesstelephone * BluetoothtM,w-LanandwLL * shortrangewireless
orDeringinForMation
partnumber UPG2009TB-E3-A package 6-pinsuperminimold Marking G2U supplyingForm *Embossedtape8mmwide *Pin1,2,3facetheperforationsideofthetape *Qty3kpcs/reel
remark Toorderevaluationsamples,contactyournearbysalesoffice. Partnumberforsampleorder:UPG2009TB-A
Caution
observeprecautionswhenhandlingbecausethesedevicesaresensitivetoelectrostaticdischarge.
California Eastern Laboratories
UPG2009TB pinConneCtions
(Top View) (Bottom View)
4 5 6 4 5 6 3 2 1 pinno. 1 2 3 4 5 6 pinname OUT1 GND OUT2 VCont2 IN VCont1
2 1
aBsoLuteMaXiMuMratings(TA=25C,unlessotherwisespecified)
parameter ControlVoltage1,2 InputPower TotalPowerDissipation OperatingAmbientTemperature StorageTemperature symbol Vcont1,2 Pin Ptot TA Tstg ratings -6.0to+6.0note1 +36 0.15 -45to+85 -55to+150 unit V dBm W C C
note |Vcont1-Vcont2|6.0V
reCoMMenDeDoperatingrange(TA=25C)
parameter ControlVoltage(High) ControlVoltage(Low) symbol Vcont(H) Vcont(L) Min. +2.7 -0.2 tYp. +2.8 0 MaX. +3.0 +0.2 unit V V
G2U
3
UPG2009TB eLeCtriCaLCHaraCteristiCs
parameter InsertionLoss symbol LINS
(TA=+25C,Vcont1=2.8V,Vcont2=0VorVcont1=0V,Vcont2=2.8,Zo=50,offchipDCblockingcapacitorsvalue; 56pF,unlessotherwisespecified)
testConditions f=0.5to1.0GHz f=2.0GHz f=2.5GHz Isolation InputReturnLoss OutputReturnLoss InputPowerat0.1dB CompressionPointnote 2ndHarmonics 3rdHarmonics SwitchingSpeed ControlCurrent 2f0 3f0 tSW Icont Vcont=2.8V/0V,RFNon ISL RLin RLout Pin(0.1dB) f=0.5to2.0GHz f=2.5GHz f=0.5to2.5GHz f=0.5to2.5GHz f=1.0GHz, Vcont=2.8V/0V f=1.0GHz,Vcont=2.8V/0V, Pin=30.5dBm f=1.0GHz,Vcont=2.8V/0V, Pin=30.5dBm - - 150 1 - 50 ns A 65 75 - dBc 65 75 - dBc Min. - - - 24 - 15 15 32.5 tYp. 0.25 0.30 0.40 28 25 20 20 34 MaX. 0.45 0.50 - - - - - - unit dB dB dB dB dB dB dB dBm
note Pin(0.1dB)isthemeasuredinputpowerlevelwhentheinsertionlossincreases0.1dBmorethanthatoflinear range.Allothercharacteristicsaremeasuredinlinearrange.
Caution itisnecessarytouseDCblockingcapacitorswiththedevice. thevalueofDCblockingcapacitorsshouldbechosentoaccommodatethefrequencyofoperation,bandwidth,switchingspeedandtheconditionwithactualboardofyoursystem.therangeofrecommendedDCblockingcapacitorvalueis lessthan100pF.
eVaLuationCirCuit(Vcont1=2.8V,Vcont2=0VorVcont2=0V,Vcont1=2.8V,offchipDCblockingcapacitors
valueC1=56pF,C2=1000pF(Bypass),usingNECstandardevaluationboard)
C2 Vcont1 6 1
C1 OUT1
G2U
IN C1 Vcont2 C2
5
2
4
3 C1
OUT2
eVaLuationBoarD
Vcont1
6pin SMM SPDT SW
OUT1
C2 C1
G2U
IN
C1
C1 C2
OUT2
NEC
Vcont2
trutHtaBLe
Vcont1 Low High Vcont2 High Low IN-OUT1 OFF ON IN-OUT2 ON OFF
tYpiCaLCHaraCteristiCs
(TA=+25CVcont1/2=2.8V/0V,Pin=0dBm,OUT2sideis50termination)
INPUT RETURN LOSS vs. FREQUENCY
CH1 S11 log MAG 10 dB/ REF 0 dB 1: -25.43 dB 1.0 GHz 2: -30.339 dB 1.5 GHz 3: -30.025 dB 2.0 GHz 4: -23.812 dB 2.5 GHz 5: -17.85 dB 3.0 GHz CH1 S21
ISOLATION vs. FEQUENCY
log MAG 10 dB/ REF 0 dB 1: -28.787 dB 1.0 GHz 2: -28.871 dB 1.5 GHz 3: -27.75 dB 2.0 GHz 4: -24.902 dB 2.5 GHz 5: -21.582 dB 3.0 GHz
Input Return Loss RLin (dB)
Isolation ISL (dB)
0 -20 -40 1 2
START 0.500 000 000 GHz
0 -20 -40 1 2
START 0.500 000 000 GHz
3
4
5
3
4
5
STOP 3.000 000 000 GHz
STOP 3.000 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
CH1 S21 log MAG 1 dB/ REF 0 dB 1: -0.620 dB 1.0 GHz 2: -0.744 dB 1.5 GHz 3: -0.881 dB 2.0 GHz 4: -1.057 dB 2.5 GHz 5: -1.302 dB 3.0 GHz
OUTPUT RETERN LOSS vs. FREQUENCY
CH1 S22 log MAG 10 dB/ REF 0 dB 1: -25.992 dB 1.0 GHz 2: -31.882 dB 1.5 GHz 3: -32.46 dB 2.0 GHz 4: -25.087 dB 2.5 GHz 5: -18.145 dB 3.0 GHz
0
1 2 3
Output Return Loss RLout (dB)
Insertion Loss LINS (dB)
0 -20 -40 1 2
START 0.500 000 000 GHz
-2.0 -4.0
4
5
3
4
5
START 0.500 000 000 GHz
STOP 3.000 000 000 GHz
STOP 3.000 000 000 GHz
Frequency f (GHz) Caution thesecharacteristicsvaluesincludethelossesoftheneCevaluationboard.
Frequency f (GHz)
remark Thegraphsindicatenominalcharacteristics.
UPG2009TB tYpiCaLCHaraCteristiCs
(f=2GHz,OUT2sideis50termination)
RELATION BETWEEN CONTROL VOLTAGE OF INSERSION LOSS
0 0.1 Insersion Loss LINS (dB) 0.2 0.3 0.4 0.5 0.6 Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 0.9 25 26 27 28 29 30 31 32 33 34 35 36 37 0.8 Input Power Pin (dBm) 0.7
RELATION BETWEEN CONTROL VOLTAGE OF 2nd HARMONICS
0 10 2nd Harmonics 2f0 (dBc) 20 30 40 50 60 70 80 90 25 26 27 28 29 30 31 32 33 34 35 36 37 Input Power Pin (dBm) Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 0 10 3rd Harmonics 3f0 (dBc) 20 30 40 50 60 70 80
RELATION BETWEEN CONTROL VOLTAGE OF 3rd HARMONICS
Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V
90 25 26 27 28 29 30 31 32 33 34 35 36 37 Input Power Pin (dBm)
remark Thegraphsindicatenominalcharacteristics.
UPG2009TB paCkageDiMensions
6-PINSUPERMINIMOLD(UNIT:mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
0 to 0.1
0.15+0.1 -0.05
0.2+0.1 -0.05
UPG2009TB reCoMMenDeDsoLDeringConDitions
Thisproductshouldbesolderedandmountedunderthefollowingrecommendedconditions.Forsoldering methodsandconditionsotherthanthoserecommendedbelow,contactyournearbysalesoffice.
solderingMethod InfraredReflow solderingConditions Peaktemperature(packagesurfacetemperature) Timeatpeaktemperature Timeattemperatureof220Corhigher Preheatingtimeat120to180C Maximumnumberofreflowprocesses Maximumchlorinecontentofrosinflux(%mass) Peaktemperature(packagesurfacetemperature) Timeattemperatureof200Corhigher Preheatingtimeat120to150C Maximumnumberofreflowprocesses Maximumchlorinecontentofrosinflux(%mass) :260Corbelow :10secondsorless :60secondsorless :12030seconds :3times :0.2%(Wt.)orbelow :215Corbelow :25to40seconds :30to60seconds :3times :0.2%(Wt.)orbelow Conditionsymbol IR260
VPS
VP215
WaveSoldering
Peaktemperature(moltensoldertemperature) :260Corbelow Timeatpeaktemperature :10secondsorless Preheatingtemperature(packagesurfacetemperature) :120Corbelow Maximumnumberofflowprocesses :1time Maximumchlorinecontentofrosinflux(%mass) :0.2%(Wt.)orbelow Peaktemperature(pintemperature) Solderingtime(persideofdevice) Maximumchlorinecontentofrosinflux(%mass) :350Corbelow :3secondsorless :0.2%(Wt.)orbelow
WS260
PartialHeating
HS350
Caution
Donotusedifferentsolderingmethodstogether(exceptforpartialheating).
02/14/2007
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
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